JPH0263521U - - Google Patents
Info
- Publication number
- JPH0263521U JPH0263521U JP14354588U JP14354588U JPH0263521U JP H0263521 U JPH0263521 U JP H0263521U JP 14354588 U JP14354588 U JP 14354588U JP 14354588 U JP14354588 U JP 14354588U JP H0263521 U JPH0263521 U JP H0263521U
- Authority
- JP
- Japan
- Prior art keywords
- electrode lead
- electronic component
- insulating resin
- resin body
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Led Device Packages (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14354588U JPH0263521U (en]) | 1988-11-01 | 1988-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14354588U JPH0263521U (en]) | 1988-11-01 | 1988-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263521U true JPH0263521U (en]) | 1990-05-11 |
Family
ID=31410461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14354588U Pending JPH0263521U (en]) | 1988-11-01 | 1988-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263521U (en]) |
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1988
- 1988-11-01 JP JP14354588U patent/JPH0263521U/ja active Pending